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5 Integrated Circuit Package topics matching:
Filter this Collection| x name | x image | x article |
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| x Dual in-line package |
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In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend...
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| x Ball grid array |
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A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.
The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern. These pins are...
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| x Plastic leaded chip carrier |
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A plastic leaded chip carrier (PLCC) is a plastic, four-sided chip carrier, with a “J”-lead and pin spacings of 0.05" (1.27 mm). Lead counts range from 20 to 84. PLCC packages can be square or rectangular. Body widths range from 0.35" to 1.15"....
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| x dip-14 | ||
| x LGA 771 |
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Socket J, also known as LGA 771, is a CPU interface introduced by Intel in 2006. It is used in Intel's most recent DP-capable server processors, the Dual-Core Xeon is codenamed Dempsey, Woodcrest, and Wolfdale and the Quad-Core processors Clovertown...
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